@chipleveladhesive doesn't have any followers yet.
- Huizhou, Guangdong China, People's Republic of
- Joined on Nov 26, 2022
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.