This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Cultivating your need to create is at the heart of Big Picture Classes, so we’re giving out this FREE digital printable to inspire you to get creative! Simply enter your email to join our email list and we’ll direct you to your download.